Shallow trench isolation structure and semiconductor device with the same

ABSTRACT

A shallow trench isolation structure and a semiconductor device. The shallow trench isolation structure includes a substrate; at least one trench located at a top surface of the substrate; and a first dielectric layer, a second dielectric layer and a third dielectric layer that are sequentially stacked on an inner wall of each of the at least one trench. A topmost surface of the first dielectric layer is lower than a topmost surface of the second dielectric layer and the top surface of the substrate, to form a first groove between the second dielectric layer and the substrate. An edge corner between the top surface of the substrate and the inner wall of each of the at least one trench is in a shape of a fillet curve. The fillet structure is smooth and round without a sharp corner, reducing point discharge and improving reliability of the shallow trench isolation structure.

CROSS-REFERENCE TO RELATED APPLICATIONS

The application claims the priorities to Chinese patent application No.201910919266.9 titled “SHALLOW TRENCH ISOLATION STRUCTURE ANDSEMICONDUCTOR DEVICE WITH THE SAME”, filed with the China NationalIntellectual Property Administration on Sep. 26, 2019, and Chinesepatent application No. 201921620570.5 titled “SHALLOW TRENCH ISOLATIONSTRUCTURE AND SEMICONDUCTOR DEVICE WITH THE SAME”, filed with the ChinaNational Intellectual Property Administration on Sep. 26, 2019, both ofwhich are incorporated herein by reference in their entireties

THE FIELD OF THE INVENTION

The present disclosure relates to the technical field of semiconductordevice, and in particular, to a shallow trench isolation structure and asemiconductor device with the shallow trench isolation structure.

BACKGROUND OF THE INVENTION

A requirement on a performance of device isolation is increasing withcontinuous development of semiconductor manufacturing technique. Shallowtrench isolation (STI) technology is developed on such requirement.Namely, isolation is achieved by a shallow trench isolation structurefabricated in an isolation device, and an insulator is filled in theshallow trench isolation structure to insulate a device to be isolated.At present, the shallow trench isolation structure plays an importantrole in fabricating a semiconductor chip. Capable to achievehigh-density isolation, the shallow trench isolation structure is widelyused in a high-density semiconductor device, such as a deep-submicrondevice and a memory. The shallow trench isolation structure has manyadvantages, and it is necessary to improve reliability of the shallowtrench isolation structure at present.

BRIEF SUMMARY

In view of the above, a shallow trench isolation structure and asemiconductor device with the shallow trench isolation are providedaccording to embodiments of the present disclosure. Technical problem inconventional technology are effectively addressed. Point discharge atthe shallow trench isolation structure is reduced, and reliability ofthe shallow trench isolation structure is improved.

In order to achieve the above object, following technology solutions areprovided according to embodiments of the present disclosure.

A shallow trench isolation structure is provided, including: asubstrate; at least one trench in the substrate; and a first dielectriclayer, a second dielectric layer and a third dielectric layer that aresequentially stacked on an inner wall of each of the at least onetrench, and a first groove between the second dielectric layer and thesubstrate. A topmost surface of the first dielectric layer is lower thana topmost surface of the second dielectric layer and a top surface ofthe substrate. An edge corner between the top surface of the substrateand the inner wall of each of the at least one trench is in a shape of afillet curve.

In one embodiment, the shallow trench isolation structure furtherincludes a fourth dielectric layer located on an inner wall of the firstgroove.

In one embodiment, the fourth dielectric layers at adjacent ones of theat least one trenches abut with each other, covering the top surface ofthe substrate.

In one embodiment, the shallow trench isolation structure furtherincludes a fifth layer at the first groove. The fifth layer is locatedin a groove formed by an inner wall of the fourth dielectric layer.

In one embodiment, the fifth layer and the second dielectric layer aremade of a same material.

In one embodiment, the shallow trench isolation structure furtherincludes a polysilicon layer located on a side away from the substrateof the fourth dielectric layer. The fifth layer and the polysiliconlayer are made of a same material.

In one embodiment, a top surface of the third dielectric layer isrecessed, and a bottom of the recessed top surface of the thirddielectric layer is lower than the topmost surface of the seconddielectric layer.

A semiconductor device is further provided, including: a substrate; atleast one trench in the substrate; and a first dielectric layer, asecond dielectric layer and a third dielectric layer that aresequentially stacked on an inner wall of each of the at least onetrench, and a first groove between the second dielectric layer and thesubstrate. A topmost surface of the first dielectric layer is lower thana topmost surface of the second dielectric layer and the top surface ofthe substrate. An edge corner between the top surface of the substrateand the inner wall of each of the at least one trench is in a shape of afillet curve.

In one embodiment, the semiconductor device further includes a fourthdielectric layer provided located on an inner wall of the first groove.

In one embodiment, the fourth dielectric layers at adjacent ones of theat least one trenches abut with each other, covering the top surface ofthe substrate.

In one embodiment, the semiconductor device further includes a fifthlayer at the first groove. The fifth layer is located in a groove formedby an inner wall of the fourth dielectric layer.

In one embodiment, the fifth layer and the second dielectric layer aremade of a same material.

In one embodiment, the semiconductor device further includes apolysilicon layer located on a side away from the substrate of thefourth dielectric layer. The fifth layer and the polysilicon layer aremade of a same material.

In one embodiment, the polysilicon layer covers the topmost surface ofthe second dielectric layer and a part of a top surface of the thirddielectric layer.

In one embodiment, a surface of the polysilicon layer above the at leastone trench is lower than a surface of the polysilicon layer above thetop surface of the substrate.

In one embodiment, the polysilicon layers at adjacent ones of the atleast one trench abut with each other, covering a corresponding regionof the top surface of the substrate.

In one embodiment, a top surface of the third dielectric layer isrecessed, and a bottom of the recessed top surface of the thirddielectric layer is lower than the topmost surface of the seconddielectric layer.

In one embodiment, the semiconductor device includes at least onestacked structure. Each of the at least one stacked structure includesat least a first wiring layer, a second wiring layer, and a hard masklayer that are sequentially stacked above the substrate. Each of the atleast one stacked structure is provided with an opening exposing atleast a part of the top surface of the third dielectric layer.

In one embodiment, a surface of the first wiring layer above the atleast one trench is lower than a surface of the first wiring layer abovethe top surface of the substrate. A surface facing away from thesubstrate of the hard mask layer is coplanar among the at least onestacked structure.

Compared with conventional technology, the technical solutions accordingto embodiments of the present disclosure achieve at least followingadvantages.

The shallow trench isolation structure and the semiconductor device areprovided, including: the substrate; the at least one trench in thesubstrate; and the first dielectric layer, the second dielectric layerand the third dielectric layer that are sequentially stacked on theinner wall of each of the at least one trench. The topmost surface ofthe first dielectric layer is lower than the topmost surface of thesecond dielectric layer and a top surface of the substrate, to form thefirst groove between the second dielectric layer and the substrate. Theedge corner between the top surface of the substrate and the inner wallof each of the at least one trench is in the shape of the fillet curve.It can be seen that according to the aforementioned technical solutions,an edge of the trench at the top surface of the substrate is a filletstructure, so that such edge is smooth and round without a sharp corner.Thereby, point discharge at the shallow trench isolation structure isreduced, and reliability of the shallow trench isolation structure isimproved.

BRIEF DESCRIPTION OF THE DRAWINGS

For clearer illustration of the technical solutions according toembodiments of the present disclosure or conventional techniques,hereinafter are briefly described the drawings to be applied inembodiments of the present disclosure or conventional techniques.Apparently, the drawings in the following descriptions are only someembodiments of the present disclosure, and other drawings may beobtained by those skilled in the art based on the provided drawingswithout creative efforts.

FIG. 1 is a schematic cross-sectional view of a shallow trench isolationstructure according to an embodiment of the present disclosure;

FIG. 2 is a schematic cross-sectional view of another shallow trenchisolation structure according to an embodiment of the presentdisclosure;

FIG. 3 is a schematic cross-sectional view of another shallow trenchisolation structure according to an embodiment of the presentdisclosure;

FIG. 4 is a schematic cross-sectional view of another shallow trenchisolation structure according to an embodiment of the presentdisclosure;

FIG. 5 is a schematic cross-sectional view of another shallow trenchisolation structure according to an embodiment of the presentdisclosure;

FIG. 6 is a schematic cross-sectional view of a semiconductor deviceaccording to an embodiment of the present disclosure;

FIG. 7 is a schematic cross-sectional view of another semiconductordevice according to an embodiment of the present disclosure; and

FIG. 8 is a schematic cross-sectional view of another semiconductordevice according to an embodiment of the present disclosure.

DETAILED DESCRIPTION

Hereinafter technical solutions in embodiments of the present disclosureare described clearly and completely in conjunction with the drawings inembodiments of the present closure. Apparently, the describedembodiments are only some rather than all of the embodiments of thepresent disclosure. Any other embodiments obtained based on theembodiments of the present disclosure by those skilled in the artwithout any creative effort fall within the scope of protection of thepresent disclosure.

As described in the background, the shallow trench isolation structureplays an important role in fabricating a semiconductor chip at present.Since it is capable to achieve high-density isolation, the shallowtrench isolation structure is widely used in a high-densitysemiconductor device such as a deep-submicron device and a memory. Theshallow trench isolation structure has many advantages, and it isnecessary to improve reliability of the shallow trench isolationstructure at present.

In view of the above, a shallow trench isolation structure and asemiconductor device are provided according to embodiments of thepresent disclosure. Technical problem in conventional technology areeffectively addressed. Point discharge at the shallow trench isolationstructure is reduced, and reliability of the shallow trench isolationstructure is improved. In order to achieve the above object, followingtechnology solutions are provided according to embodiments of thepresent disclosure. The technical solutions are described in detail inconjunction with FIGS. 1 to 8.

Reference is made to FIG. 1, which is a schematic cross-sectional viewof a shallow trench isolation structure according to an embodiment ofthe present disclosure. The shallow trench isolation structure includes:a substrate 100; at least one trench 110 located in the substrate 100;and a first dielectric layer 210, a second dielectric layer 220 and athird dielectric layer 230 that are sequentially stacked on an innerwall of each of the at least one trench 110. A topmost surface of thefirst dielectric layer 210 is lower than a topmost surface of the seconddielectric layer 220 and a top surface of the substrate 100, to form afirst groove 211 between the second dielectric layer 220 and thesubstrate 100. An edge corner between the top surface of the substrate100 and the inner wall of each of the at least one trench 110 is in ashape of a fillet curve 120.

In one embodiment, a first dielectric layer and a second dielectriclayer that are flush at the top may be formed in fabricating the shallowtrench isolation structure. Then, the topmost surface of the firstdielectric layer is etched to form the first groove. The edge cornerbetween the top surface of the substrate and the inner wall of eachtrench may also be etched in etching the first dielectric layer, so thatthe first groove and the fillet curve at the edge corner between the topsurface of the substrate and the inner wall of each trench arefabricated in a same process. Thereby, a fabrication process can besimplified, and a fabrication cost can be reduced.

It should be noted that herein a process of fabricating the filletstructure of the edge corner between the top surface of the substrateand the inner wall of each trench is not limited to the aforementionedprocess. In another of the present disclosure, the first groove and thefillet curve at the edge corner between the top surface of the substrateand the inner wall of each trench may be separately fabricated. Thepresent disclosure is not limited thereto, and a specific process may bedesigned according to a practical application.

In one embodiment, the topmost surface of the first dielectric layer210, the topmost surface of the second dielectric layer 220, and a topsurface of the third dielectric layer 230 are all lower than the topsurface of the substrate 100. The present disclosure is not limitedthereto.

According to embodiments of the present disclosure, an edge of thetrench at the top surface of the substrate is a fillet structure, sothat such edge is smooth and round without a sharp corner. Thereby,point discharge of the shallow trench isolation structure is reduced atan edge on the top surface of the substrate, and reliability of theshallow trench isolation structure is improved.

In one embodiment, the substrate may be a silicon substrate, the firstdielectric layer may be an oxide dielectric layer, the second dielectriclayer may be a nitride dielectric layer, and the third dielectric layermay be an oxide dielectric layer. The present disclosure is not limitedthereto. In another embodiment, the substrate, the first dielectriclayer, the second dielectric layer, and the third dielectric layer maybe made of other materials.

Reference is made to FIG. 2, which is a schematic cross-sectional viewof another shallow trench isolation structure according to an embodimentof the present disclosure. The shallow trench isolation structure in oneembodiment further includes a fourth dielectric layer 240 located on aninner wall of the first groove 211.

The fourth dielectric layer is formed along the inner wall of the firstgroove in the shallow trench isolation structure. Since the first grooveis located at the edge corner between the top surface of the substrateand the inner wall of each trench, the fourth dielectric layer isoverlapped with the edge corner. Thereby, the fourth dielectric layercovers at least a part of the edge corner between the top surface of thesubstrate and the inner wall of each trench. The point discharge of theshallow trench isolation structure is further reduced at the edge on thetop surface of the substrate, and the reliability of the shallow trenchisolation structure is further improved.

Reference is further made to FIG. 3, which is a schematiccross-sectional view of another shallow trench isolation structureaccording to an embodiment of the present disclosure. The fourthdielectric layers 240 of adjacent trenches 110 abut with each other,covering the top surface of the substrate 100.

In one embodiment, the fourth dielectric layer may be a gate oxidelayer. The present disclosure is not limited thereto. In anotherembodiment, the fourth dielectric layer may be made of polysilicon.

The fourth dielectric layer covers the top surface of the substratebetween the adjacent trenches when being fabricated in the first groove,and thereby it is not necessary to separately fabricate a dielectriclayer covering the top surface of the substrate. A fabrication processof the shallow trench isolation structure is simplified, and afabrication cost is reduced.

It should be noted that, in another embodiment, the fourth dielectriclayer and the dielectric layer on the top surface of the substrate maybe separately fabricated. The present disclosure is not limited thereto,and a specific process may be designed according to a practicalapplication.

Reference is made to FIG. 4, which is a schematic cross-sectional viewof another shallow trench isolation structure according to an embodimentof the present disclosure. The shallow trench isolation structurefurther includes a fifth layer 250 at the first groove 211, and thefifth layer 250 is located in a groove formed by an inner wall of thefourth dielectric layer 240.

In one embodiment, the fifth layer and the second dielectric layer maybe made of a same material. The present disclosure is not limitedthereto.

An alternative is shown in FIG. 5, which is a schematic cross-sectionalview of another shallow trench isolation structure according to anembodiment of the present disclosure. The shallow trench isolationstructure further includes a polysilicon layer 300 located on a sideaway from the substrate of the fourth dielectric layer 240. The fifthlayer 250 and the polysilicon layer 300 are made of a same material.

In one embodiment, the shallow trench isolation structure includes thepolysilicon layer located on the side facing away from the substrate ofthe fourth dielectric layer, and the polysilicon layer is provided withan opening at a region corresponding to the third dielectric layer, soas to expose the top surface of the third dielectric layer. In a casethat the fifth layer and the polysilicon layer are made of the samematerial, the fifth layer may be obtained by filling the groove betweenthe inner wall of the fourth dielectric layer when the polysilicon layerbeing fabricated. Thereby, the fifth layer and the polysilicon layer arefabricated in a same process. A fabrication process of the shallowtrench isolation structure is simplified, and a fabrication cost isreduced.

It should be noted that in another embodiment, the fifth layer and thepolysilicon layer may be separately fabricated in the case that thefifth layer and the polysilicon layer are made of the same material. Thepresent disclosure is not limited thereto.

Reference is made to FIGS. 1 to 5. In one embodiment, the top surface ofthe third dielectric layer 230 is recessed, and a bottom of the recessedtop surface of the third dielectric layer is lower than the topmostsurface of the second dielectric layer 220.

Correspondingly, a semiconductor device is further provided according toan embodiment of the present disclosure. The semiconductor device may bea semiconductor memory, which is not limited herein. The semiconductordevice includes the shallow trench isolation structure according to anyaforementioned embodiment. Reference is made to FIG. 1. Thesemiconductor device according to an embodiment of the presentdisclosure includes: a substrate 100; at least one trench 110 in thesubstrate 100; and a first dielectric layer 210, a second dielectriclayer 220 and a third dielectric layer 230 that are sequentially stackedon an inner wall of each of the at least one trench 110. A topmostsurface of the first dielectric layer 210 is lower than a topmostsurface of the second dielectric layer 220 and the top surface of thesubstrate 100, to form a first groove 211 between the second dielectriclayer 220 and the substrate 100. An edge corner between the top surfaceof the substrate 100 and the inner wall of each of the at least onetrench 110 is in a shape of a fillet curve 120.

In one embodiment, a first dielectric layer and a second dielectriclayer that are flush at the top may be formed in fabricating the shallowtrench isolation structure of the semiconductor device. Then, thetopmost surface of the first dielectric layer is etched to form thefirst groove. The edge corner between the top surface of the substrateand the inner wall of each trench may also be etched in etching thefirst dielectric layer, so that the first groove and the fillet curve atthe edge corner between the top surface of the substrate and the innerwall of each trench are fabricated in a same process. Thereby, afabrication process can be simplified, and a fabrication cost can bereduced.

It should be noted that herein a process of fabricating the filletstructure of the edge corner between the top surface of the substrateand the inner wall of each trench is not limited to the aforementionedprocess. In another of the present disclosure, the first groove and thefillet curve at the edge corner between the top surface of the substrateand the inner wall of each trench may be separately fabricated. Thepresent disclosure is not limited thereto, and a specific process may bedesigned according to a practical application.

In one embodiment, the topmost surface of the first dielectric layer210, the topmost surface of the second dielectric layer 220, and a topsurface of the third dielectric layer 230 are all lower than the topsurface of the substrate 100. The present disclosure is not limitedthereto.

According to embodiments of the present disclosure, an edge of thetrench at the top surface of the substrate is a fillet structure, sothat such edge is smooth and round without a sharp corner. Thereby,point discharge of the shallow trench isolation structure is reduced atan edge on the top surface of the substrate, and reliability of theshallow trench isolation structure is improved.

In one embodiment, the substrate may be a silicon substrate, the firstdielectric layer may be an oxide dielectric layer, the second dielectriclayer may be a nitride dielectric layer, and the third dielectric layermay be an oxide dielectric layer. The present disclosure is not limitedthereto. In another embodiment, the substrate, the first dielectriclayer, the second dielectric layer, and the third dielectric layer maybe made of other materials.

Reference is made to FIG. 2, which is a schematic cross-sectional viewof another shallow trench isolation structure according to an embodimentof the present disclosure. The semiconductor device in one embodimentfurther includes a fourth dielectric layer 240 located on an inner wallof the first groove 211.

The fourth dielectric layer is formed along the inner wall of the firstgroove in the shallow trench isolation structure of the semiconductordevice. Since the first groove is located at the edge corner between thetop surface of the substrate and the inner wall of each trench, thefourth dielectric layer is overlapped with the edge corner. Thereby, thefourth dielectric layer covers at least a part of the edge cornerbetween the top surface of the substrate and the inner wall of eachtrench. The point discharge of the shallow trench isolation structure isfurther reduced at the edge on the top surface of the substrate, and thereliability of the shallow trench isolation structure is furtherimproved.

Reference is further made to FIG. 3, which is a schematiccross-sectional view of another shallow trench isolation structureaccording to an embodiment of the present disclosure. The fourthdielectric layers 240 of adjacent trenches 110 abut with each other,covering the top surface of the substrate 100.

In one embodiment, the fourth dielectric layer may be a gate oxidelayer. The present disclosure is not limited thereto. In anotherembodiment, the fourth dielectric layer may be made of polysilicon.

The fourth dielectric layer covers the top surface of the substratebetween the adjacent trenches when being fabricated in the first groove,and thereby it is not necessary to separately fabricate a dielectriclayer covering the top surface of the substrate. A fabrication processof the shallow trench isolation structure in the semiconductor device issimplified, and a fabrication cost is reduced.

It should be noted that, in another embodiment, the fourth dielectriclayer and the dielectric layer on the top surface of the substrate maybe separately fabricated. The present disclosure is not limited thereto,and a specific process may be designed according to a practicalapplication.

Reference is made to FIG. 4, which is a schematic cross-sectional viewof another shallow trench isolation structure according to an embodimentof the present disclosure. The semiconductor device further includes afifth layer 250 at the first groove 211, and the fifth layer 250 islocated in a groove formed by an inner wall of the fourth dielectriclayer 240.

It can be seen from the shallow trench isolation structure of thesemiconductor device as shown in FIG. 4, that the fifth layer and thesecond dielectric layer may be made of a same material. Alternatively,the fifth layer may be made of a different material. Reference is madeto FIG. 5, which is a schematic cross-sectional view of another shallowtrench isolation structure according to an embodiment of the presentdisclosure. The semiconductor further includes a polysilicon layer 300located on a side away from the substrate of the fourth dielectric layer240. The fifth layer 250 and the polysilicon layer 300 are made of asame material.

In one embodiment, the shallow trench isolation structure includes thepolysilicon layer located on the side facing away from the substrate ofthe fourth dielectric layer, and the polysilicon layer may cover thetopmost surface of the second dielectric layer and a part of the topsurface of the third dielectric layer. Namely, the polysilicon layercovers the topmost surface of the second dielectric layer, and isprovided with an opening at a region corresponding to the thirddielectric layer, so as to expose another part of the top surface of thethird dielectric layer (where the exposed part may correspond to acentral region of the third dielectric layer). In a case that the fifthlayer and the polysilicon layer are made of the same material, the fifthlayer may be obtained by filling the groove between the inner wall ofthe fourth dielectric layer when the polysilicon layer being fabricated.Thereby, the fifth layer and the polysilicon layer are fabricated in asame process. A fabrication process of the shallow trench isolationstructure is simplified, and a fabrication cost is reduced.

In one embodiment, the polysilicon layer may be a layer structure with auniform thickness, as shown in FIG. 5. In one embodiment, a surface ofthe polysilicon layer 300 above the trench 110 is lower than a surfaceof the polysilicon layer above the top surface of the substrate 100.

It should be noted that in another embodiment, the fifth layer and thepolysilicon layer may be separately fabricated in the case that thefifth layer and the polysilicon layer are made of the same material. Thepresent disclosure is not limited thereto.

A position of the shallow trench isolation structure in thesemiconductor device is not limited herein. For different positions ofthe shallow trench isolation structure in a semiconductor device, acorresponding structure of the shallow trench isolation structure isalso different. In one embodiment, the semiconductor device includes afunctional film layer above the substrate. The functional film layer maybe a stacked structure. The functional film layer may be located at asurface facing away from the substrate of fourth dielectric layer. Thefunctional film layer may be located on a surface facing away from thesubstrate of the polysilicon layer. The present disclosure is notlimited thereto. In one embodiment, the stacked structure may include atleast a second wiring layer and a hard mask layer that are sequentiallystacked above the substrate in the semiconductor device. The stackedstructure is provided with an opening exposing at least a part of thetop surface of the third dielectric layer.

Hereinafter a technical solution is specifically described with thefunctional film layer being located at the surface facing away from thesubstrate of the polysilicon layer. Reference is made to FIG. 6, whichis a schematic cross-sectional view of a semiconductor device accordingto an embodiment of the present disclosure. In a case that thepolysilicon layer 300 is provided in the shallow trench isolationstructure on the side facing away from the substrate of the fourthdielectric layer 240, the functional film layer 400 is furtherfabricated on the side facing away from the substrate 100 of thepolysilicon layer 300. The functional film layer 400 is provided with anopening corresponding to the third dielectric layer 230.

The fourth dielectric layers 240 at the adjacent trenches 110 may abutwith each other covering the top surface of the substrate 100, and thepolysilicon layers 300 at the adjacent trenches 110 may abut with eachother, covering a region corresponding to the top surface of thesubstrate 100, as shown in FIG. 6. Thereby, the polysilicon layer 300 inthis embodiment may cover the fourth dielectric layer 240 and extends tothe top surface of the third dielectric layer 230 in the adjacent trench110, and the polysilicon layer 300 is provided with the opening at aregion corresponding to the third dielectric layer 230. Further, thefunctional film layer 400 is located on the side facing away from thesubstrate 100 of the polysilicon layer 300. The functional film layer400 may cover the polysilicon layer 300, and the functional film layer400 is also provided with an opening at the region corresponding to thethird dielectric layer 230. Namely, the functional film layer 400 maybridge between the adjacent two trenches 110 to connect them.

In another embodiment, for a different position of the shallow trenchisolation structure in the semiconductor device, a structure of thefunctional film layer is also different.

In one embodiment, the first wiring layer, the second wiring layer, andthe hard mask layer are sequentially stacked on the side facing awayfrom the substrate of the polysilicon layer. The first wiring layer, thesecond wiring layer, and the hard mask layer are provided with a sameopening as that for the polysilicon layer. Reference is made to FIG. 7,which is a schematic cross-sectional view of another semiconductordevice according to an embodiment of the present disclosure. Thefunctional film layer in one embodiment may at least include the firstwiring layer 410, the second wiring layer 420 and the hard mask layer430 that are sequentially stacked, from the polysilicon layer 300. Amaterial of the first wiring layer 410 may include, but is not limitedto, titanium or titanium nitride. A material of the second wiring layer420 may be metal (such as tungsten). A material of the hard mask layer430 may include, but not limited to, a nitride.

In one embodiment, a surface of the first wiring layer above the trenchis lower than a surface of the first wiring layer above the top surfaceof the substrate. Surfaces facing away from the substrate of the hardmask layers are coplanar.

As shown in FIG. 7, the polysilicon layer 300 in one embodiment has auniform thickness. The topmost surface of the first dielectric layer210, the topmost surface of the second dielectric layer 220, and the topsurface of the third dielectric layer 230 each is lower than the topsurface of the substrate 100 at the trench 110. Thereby, the surfacefacing away from the substrate 100 of the polysilicon layer 300 is notplanar, and in a shape that a part above the trench 110 is lower than apart above the top surface of the substrate 100. Moreover, both thefirst wiring layer 410 and the second wiring layer 420 may be a layerstructure with a uniform thickness. Thereby, each surface facing awayfrom the substrate 100, of the first wiring layer 410 and the secondwiring layer 420, are in a shape that a part above the trench 110 islower than a part above the top surface of the substrate 100. In oneembodiment, the hard mask layer 430 may be a planarized layer, and thesurfaces of the hard mask layers facing away from the substrate 100 maybe coplanar. The present disclosure is not limited thereto.

Reference is made to FIG. 8, which is a schematic cross-sectional viewof another semiconductor device according to an embodiment of thepresent disclosure. In one embodiment, a filling layer 500 may obtainedby directly filling at a side facing away from the substrate 100 of thefourth dielectric layer 240 in the semiconductor device. A material ofthe filling layer 500 may include, but is not limited to, an oxide.

It should be noted that what is shown in FIGS. 6 to 8 are only severalof all the structures that may be applied at the shallow trenchisolation structure according to embodiments of the present disclosure.The present disclosure is not limited thereto. A specific design isbased on a type of the semiconductor device and a position of theshallow trench isolation structure in the semiconductor device.

Reference is made to FIGS. 1 to 8. In one embodiment, the top surface ofthe third dielectric layer 230 is recessed, and a bottom of the recessedtop surface of the third dielectric layer 230 is lower than the topmostsurface of the second dielectric layer 220.

The shallow trench isolation structure and the semiconductor device areprovided according to embodiments of the disclosure, including: thesubstrate; the at least one trench in the substrate; and the firstdielectric layer, the second dielectric layer and the third dielectriclayer that are sequentially stacked on the inner wall of each of the atleast one trench. The topmost surface of the first dielectric layer islower than the topmost surface of the second dielectric layer and thetop surface of the substrate, to form the first groove between thesecond dielectric layer and the substrate. The edge corner between thetop surface of the substrate and the inner wall of each of the at leastone trench is in the shape of the fillet curve. It can be seen thataccording to the aforementioned technical solutions, an edge of thetrench at the top surface of the substrate is a fillet structure, sothat such edge is smooth and round without a sharp corner. Thereby,point discharge at the shallow trench isolation structure is reduced,and reliability of the shallow trench isolation structure is improved.

According to the description of the disclosed embodiments, those skilledin the art can implement or use the present disclosure. Variousmodifications made to these embodiments may be obvious to those skilledin the art, and the general principle defined herein may be implementedin other embodiments without departing from the spirit or scope of thepresent disclosure. Therefore, the present disclosure is not limited tothe embodiments described herein but confirms to a widest scope inaccordance with principles and novel features disclosed in the presentdisclosure.

What is claimed is:
 1. A shallow trench isolation structure, comprising:a substrate; at least one trench in the substrate; a first dielectriclayer, a second dielectric layer and a third dielectric layer that aresequentially stacked on an inner wall of each of the at least onetrench; and a first groove between the second dielectric layer and thesubstrate, wherein a topmost surface of the first dielectric layer islower than a topmost surface of the second dielectric layer and atopmost surface of the substrate; wherein an edge corner between the topsurface of the substrate and the inner wall of each of the at least onetrench is in a shape of a fillet curve.
 2. The shallow trench isolationstructure according to claim 1, further comprising: a fourth dielectriclayer located on an inner wall of the first groove.
 3. The shallowtrench isolation structure according to claim 2, wherein the fourthdielectric layers at adjacent ones of the at least one trenches abutwith each other, covering the top surface of the substrate.
 4. Theshallow trench isolation structure according to claim 2, furthercomprising: a fifth layer at the first groove, wherein the fifth layeris located in a groove formed by an inner wall of the fourth dielectriclayer.
 5. The shallow trench isolation structure according to claim 4,wherein the fifth layer and the second dielectric layer are made of asame material.
 6. The shallow trench isolation structure according toclaim 4, further comprising: a polysilicon layer located on a side awayfrom the substrate of the fourth dielectric layer, wherein the fifthlayer and the polysilicon layer are made of a same material.
 7. Theshallow trench isolation structure according to claim 1, wherein a topsurface of the third dielectric layer is recessed, and a bottom of therecessed top surface of the third dielectric layer is lower than thetopmost surface of the second dielectric layer.
 8. A semiconductordevice, comprising: a substrate; at least one trench in the substrate; afirst dielectric layer, a second dielectric layer and a third dielectriclayer that are sequentially stacked on an inner wall of each of the atleast one trench; and a first groove between the second dielectric layerand the substrate, wherein a topmost surface of the first dielectriclayer is lower than a topmost surface of the second dielectric layer anda top surface of the substrate; and wherein an edge corner between thetop surface of the substrate and the inner wall of each of the at leastone trench is in a shape of a fillet curve.
 9. The semiconductor deviceaccording to claim 8, further comprising: a fourth dielectric layerlocated on an inner wall of the first groove.
 10. The semiconductordevice according to claim 9, wherein the fourth dielectric layers atadjacent ones of the at least one trenches abut with each other,covering the top surface of the substrate.
 11. The semiconductor deviceaccording to claim 9, at the first groove, further comprising: a fifthlayer at the first groove, wherein the fifth layer is located in agroove formed by an inner wall of the fourth dielectric layer.
 12. Thesemiconductor device according to claim 11, wherein the fifth layer andthe second dielectric layer are made of a same material.
 13. Thesemiconductor device according to claim 11, further comprising: apolysilicon layer located on a side away from the substrate of thefourth dielectric layer, wherein the fifth layer and the polysiliconlayer are made of a same material.
 14. The semiconductor deviceaccording to claim 13, wherein the polysilicon layer covers the topmostsurface of the second dielectric layer and a part of a top surface ofthe third dielectric layer.
 15. The semiconductor device according toclaim 14, wherein a surface of the polysilicon layer above the at leastone trench is lower than a surface of the polysilicon layer above thetop surface of the substrate
 16. The semiconductor device according toclaim 14, wherein the polysilicon layers at adjacent ones of the atleast one trench abut with each other, covering a corresponding regionof the top surface of the substrate.
 17. The semiconductor deviceaccording to claim 8, wherein the top surface of the third dielectriclayer is recessed, and a bottom of the recessed top surface of the thirddielectric layer is lower than the topmost surface of the seconddielectric layer.
 18. The semiconductor device according to claim 8,further comprising at least one stacked structure, wherein: each of theat least one stacked structure comprises at least a first wiring layer,a second wiring layer, and a hard mask layer that are sequentiallystacked above the substrate; and each of the at least one stackedstructure is provided with an opening exposing at least a part of a topsurface of the third dielectric layer.
 19. The semiconductor deviceaccording to claim 18, wherein: a surface of the first wiring layerabove the at least one trench is lower than a surface of the firstwiring layer above the top surface of the substrate; and a surfacefacing away from the substrate of the hard mask layer is coplanar amongthe at least one stacked structure.